A collection of Design & Tech Trends selected by TraceParts April 2026 |
|
• High-Performance Cooling, Now in 4U | nVent Schroff • Modular work benches | item
• E/E Simulation for Automotive | Ansys • See what’s new in Inventor 2027 | Autodesk • TE Connectivity NanoMQS | Mouser Electronics • MOVE: Driving Robotics Forward | EBV Elektronik • AirBorn verSI Series | TTI • Boardmount Connectors at 3M | RS Group |
|
|
|
AdGlare Ad Server: Design & Tech Trends NL-ENemea
 |
|
|
|
 |
High-Performance Cooling, Now in 4U |
Optimized cooling performance |
Meet the new LHX 4U Air-to-Liquid Heat Exchanger—compact, rugged, and built for performance. Delivering 7.5 kW thermal capacity, this all-in-one solution replaces legacy 8U systems while optimizing airflow and pressure. Engineered for stability, it ensures reliable cooling even under high shock and vibration. |
|
|
|
 |
Modular work benches |
Benefits, tips and solutions |
In a dynamic market environment, the ability to adapt quickly is crucial. In our guide, discover how modular work benches help you respond fast to changes on the market. Find out how to design your production processes with greater efficiency and flexibility. |
|
|
|
|
 |
E/E Simulation for Automotive |
From chip to full SDV architecture |
Optimize electrical and electronic (E/E) architecture design development and validation with multiphysics simulation. From semiconductor innovation to electronics for software defined systems, streamline workflows, reduce errors and improve performance and reliability for robust automotive components.
|
|
|
|
 |
See what’s new in Inventor 2027 |
Learn about key features and updates |
Reduce design time and improve workflow efficiency with the latest updates in Inventor 2027. This live webinar shows how to work smarter with supplier CAD models, automate repetitive tasks, and streamline assemblies—so you can move from concept to production faster. |
|
|
|
|
 |
TE Connectivity NanoMQS |
Automotive grade mini connector system |
Featuring a 1.8mm pin-to-pin pitch and a locking lance terminal design, NanoMQS reduces PCB footprint by up to 50% but keeps 6A current capacity. A wide range suitable for round wire or flat flexible/printed cables. Ideal in battery/cell control modules, engine control units, airbags, and blackbox applications with extreme space constraints. Available at Mouser Electronics. |
|
|
|
|
MOVE: Driving Robotics Forward |
Reduce complexity, accelerate your project |
EBV Elektronik introduces a new initiative from EBV Embedded Solutions designed to support the development of next-generation robotic systems. From component selection to full-system integration, EBV Embedded Solutions combines technical engineering support with a robust supply chain to turn robotic visions into competitive market realities. |
|
|
|
|
 |
AirBorn verSI Series |
High-Density Connectors |
AirBorn verSI connectors deliver high-speed, high-density signal integrity with rugged, military-grade designs. Scalable and customizable, they support various mounting and contact options. |
|
|
|
 |
Boardmount Connectors at 3M |
Performance across a wide range of designs |
3M™ Four-Wall Header 2500 Series is a 2.54 x 2.54 mm wire-to-board connector with a low-profile design that provides design flexibility and saves space. Various versions and board mounting options. Its high-temperature insulator allows the header to be used for "no-lead" soldering operations. |
|
|
|
|